In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. It must address management practices to consider customer needs, designing those requirements into the product, an… 71–76, Ban Y, Lucas K, Pan D Z. Radiation-induced soft error analysis of SRAMs in SOI FinFET technology: a device to circuit approach. Proc SPIE, 2013: 8880, Ou J J, Yu B, Gao J-R, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. CSL: coordinated and scalable logic synthesis techniques for effective NBTI reduction. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Austin, 2015. Metal-density-driven placement for CMP variation and routability. http://www.synopsys.com, Calibre pattern matching. IEEE Trans Electron Dev, 2011, 58: 3652–3666, Wang R S, Huang R, Kim D-W, et al. Proc SPIE, 2012: 8326, Kang W L, Feng C, Chen Y. In: Proceedings of International Conference on VLSI Design, Mumbai, 2014. Detailed routing for spacer-is-metal type self-aligned double/quadruple patterning lithography. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 939–952, Yuan K, Yang J-S, Pan D Z. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. IEEE Electron Dev Lett, 2008. 33.5.1–33.5.4, Roy S, Pan D Z. Formulating the electrical behavior of a design in terms of probability distributions on its tolerances is a … TRIAD: a triple patterning lithography aware detailed router. IEEE Trans Comput Aided Des Integr Circ Syst, 2013, 32: 419–432, Hougardy S, Nieberg T, Schneider J. BonnCell: automatic layout of leaf cells. David Z. Pan. Impacts of random telegraph noise (RTN) on digital circuits. PubMed Google Scholar. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2007. Deep understanding of AC RTN in MuGFETs through new characterization method and impacts on logic circuits. 389–391, Ebrahimi M, Oboril F, Kiamehr S, et al. Fast yield-driven fracture for variable shaped-beam mask writing. Proc SPIE, 2003, 5256, Roseboom E, Rossman M, Chang F-C, et al. Proc SPIE, 2015: 9427, Mirsaeedi M, Torres J A, Anis M. Self-aligned double-patterning (SADP) friendly detailed routing. 1167–1172, Wen W-Y, Li J-C, Lin S-Y, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2011. Contact-hole patterning for random logic circuit using block copolymer directed self-assembly. 4A.5.1–4A.5.7, Grasser T. Bias Temperature Instability for Devices and Circuits. 27–34, Chen T C, Cho M, Pan D Z, et al. Aging-aware logic synthesis. Design for Manufacturability The success of a product’s development and production begins with the design. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Taipei, 2010. Design for Reliability Design for reliability (or RBDO) includes two distinct categories of analysis, namely (1) design for variability (or variability-based design optimization), which focuses on the variations at a given moment in time in the product life; From: Diesel Engine System Design, 2013 139–140, Zou J B, Wang R S, Luo M L, et al. The reliability of your device is defined by its ability to meet performance objectives, which requires that you design your PCB for functionality. 59, 061406 (2016). And the design specifications directly affect the manufacturability of the board. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. Fast dual graph based hotspot detection. Manufacturability is in many ways dictated by a part’s design, and can have huge implications as to the cost and effectiveness of the end product. Methodology for standard cell compliance and detailed placement for triple patterning lithography. The difference between the best thermally optimal design and the best manufacturable design represents the “manufacturability gap” [4, 5]. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Napa Valley, 2012. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2009. IEEE Trans Very Large Scale Integr Syst, 2015, 23: 118–130, Pak J, Lim S K, Pan D Z. Electromigration-aware routing for 3D ICs with stress-aware EM modeling. 821–824, Grasser T, Rott K, Reisinger H, et al. Directed self-assembly based cut mask optimization for unidirectional design. Stress migration and electromigration improvement for copper dual damascene interconnection. 63–66, Lin Y-H, Li Y-L. Proc SPIE, 2004, 5567, Kahng A B, Xu X, Zelikovsky A. Using many of the benefits inherent in high volume standard silicon manufacturing processes, WiSpry leverages industry standard reliability and statistical process controls, to overcome key manufacturing challenges unique to MEMS. 1–6, Realov S, Shepard K L. Analysis of random telegraph noise in 45-nm CMOS using on-chip characterization system. 398–403, Lin Y-H, Ban Y-C, Pan D Z, et al. Efficient process-hotspot detection using range pattern matching. ABSTRACT. Simultaneous EUV flare-and CMP-aware placement. 453–460, Ye W, Yu B, Ban Y-C, et al. DSA template mask determination and cut redistribution for advanced 1D gridded design. 591–596, Lin Y-H, Yu B, Pan D Z, et al. Challenges and opportunities in applying grapho-epitaxy DSA lithography to metal cut and contact/via applications. Title: Nanometer VLSI Physical Design for Manufacturability and Reliability 1 Nanometer VLSI Physical Design for Manufacturability and Reliability Ph.D. Proposal May 3rd, 2007. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2006. In: Proceedings of IEEE International Symposium on Quality Electronic Design (ISQED), Santa Clara, 2011. However, in order to perform reliably, the board must be well-manufactured. 11.7.1–11.7.4, Wang T C, Hsieh T E, Wang M-T, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Anaheim, 2010. Design for reliability, testability and manufacturability of memory chips Abstract: The number of transistors on integrated-circuit chips is growing exponentially. A Perspective from Design for Reliability and Manufacturability Utilizing Simulations Yan Liu and Scott Hareland Medtronic, Inc. United States 1. Proc SPIE, 2005, 5751, Kahng A B, Xu X, Zelikovsky A. Yield-and cost-driven fracturing for variable shaped-beam mask writing. MOS device aging analysis with HSPICE and CustomSim. On refining row-based detailed placement for triple patterning lithography. Engineers often talk about the importance of design for reliability (DfR) and the impact it has on a product’s overall efficiencies and success. 17 Design Reliability Manufacturability Coach jobs available on Indeed.com. DfM can reduce many reliability costs, since products can be quickly assembled from fewer parts. CLASS: combined logic and architectural soft error sensitivity analysis. http://www.mentor.com/products, Capodieci L. Beyond 28nm: new frontiers and innovations in design for manufacturability at the limits of the scaling roadmap. 65–66, Bita I, Yang J K W, Jung Y S, et al. 283–289, Ma Q, Zhang H B, Wong M D F. Triple patterning aware routing and its comparison with double patterning aware routing in 14nm technology. An effective triple patterning aware grid-based detailed routing approach. Design For Reliability Manufacturability Handbook full free pdf books 1641–1646, Gillijns W, Sherazi S M Y, Trivkovic D, et al. There are many factors influencing the product design resulting in a profitable business. In this case, it included: workmanship, PCB design for reliabilty and manufacturability, strength analysis, life cycling on connectors, switches and electromechanical components, detailed black-box functional and software analysis, key component review, and other areas. Electron beam direct write lithography flexibility for ASIC manufacturing an opportunity for cost reduction. The reliability of your device is defined by its ability to meet performance objectives, which requires that you design your PCB for functionality. 83–86, Fang S-Y, Hong Y-X, Lu Y-Z. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 1229–1242, Liebmann L, Pietromonaco D, Graf M. Decomposition-aware standard cell design flows to enable double-patterning technology. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. In this paper, we will discuss some key process technology and VLSI design co-optimization issues in nanometer VLSI. 502–507, Cho H, Cher C-Y, Shepherd T, et al. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Dresden, 2014. IEEE Trans Depend Secur Comput, 2012, 9: 770–776, Jiang I H-R, Chang H-Y, Chang C-L. WiT: optimal wiring topology for electromigration avoidance. https://doi.org/10.1007/s11432-016-5560-6. Proc SPIE, 2011: 7974, Gao J-R, Pan D Z. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2007. 249–254, Kim J, Fan M. Hotspot detection on Post-OPC layout using full chip simulation based verification tool: A case study with aerial image simulation. 1–8, Yu B, Pan D Z. 1047–1052, Wu K-C, Marculescu D. Joint logic restructuring and pin reordering against NBTI-induced performance degradation. 61–68, Oboril F, Tahoori M B. ExtraTime: modeling and analysis of wearout due to transistor aging at microarchitecturelevel. 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Accurate lithography hotspot detection based on principal component analysis-support vector machine classifier with hierarchical data clustering. http://www.cadence.com, Synopsys IC Validator. 789–794, Xiao Z G, Zhang H B, Du Y L, et al. IEEE J Emerg Sel Top Circ Syst, 2011, 1: 50–58, Mallik A, Zuber P, Liu T T, et al. New York: Springer Science & Business Media, 2013, Liu C Z, Zou J B, Wang R S, et al. IEEE International Symposium on Quality Electronic Design (ISQED), Santa Clara, 2012, Abercrombie D. Mastering the magic of multi-patterning. In: Proceedings of IEEE/IFIP International Conference on Dependable Systems and Networks (DSN), Boston, 2012. IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 1671–1680, Ding D, Wu X, Ghosh J, et al. A cell-based row-structure layout decomposer for triple patterning lithography. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Taipei, 2010. 25: 6, Cho M, Ban Y, Pan D Z. 50: 6, Fang S-Y. Design for manufacturability (also sometimes known as design for manufacturing or DFM) is the general engineering practice of designing products in such a way that they are easy to manufacture. 289–294, Xu X Q, Cline B, Yeric G, et al. 299–302, Li D-A, Marek-Sadowska M, Nassif S R. A method for improving power grid resilience to electromigration-caused via failures. In: Proceedings of IEEE International Reliability Physics Symposium (IRPS), Waikoloa, 2014. Design for Manufacturability and Reliability in Nano Era Abstract: The bottom line of any company is to maximize the profit from any given product. 839–846, Yu Y-T, Chan Y-C, Sinha S, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. 28: 6, Yang J-S and Pan D Z. Overlay aware interconnect and timing variation modeling for double patterning technology. Design for Manufacturability and Reliability for TSV-based 3D ICs David Z. Pan1, Sung Kyu Lim 2, Krit Athikulwongse , Moongon Jung , Joydeep Mitra 1, Jiwoo Pak , Mohit Pathak2, and Jae-seok Yang1 1 Department of ECE, University of Texas at Austin, Austin, TX, USA 2 School of ECE, Georgia Institute of Technology, Atlanta, GA, USA dpan@ece.utexas.edu, limsk@gatech.edu Modeling and minimization of PMOS NBTI effect for robust nanometer design. Methodology for standard cell compliance and detailed placement for triple patterning lithography. 80: 1–80: 6, Lienig J. Electromigration and its impact on physical design in future technologies. Proc SPIE, 2011: 7974, Agarwal K B, Alpert C J, Li Z, et al. 545–550, Ding D, Torres J A, Pan D Z. SAMURAI: an accurate method for modelling and simulating nonstationary random telegraph noise in SRAMs. Standard cell layout regularity and pin access optimization considering middle-of-line. 488–493, van Oosten A, Nikolsky P, Huckabay J, et al. 33–40, Pak J, Yu B, Pan D Z. Electromigration-aware redundant via insertion. To meet and exceed the expectations of its customers, WiSpry solutions have been engineered with reliability & manufacturability as an intrinsic part of the design. This makes it increasingly difficult to satisfy the continuing demand for ever higher reliability of chips. Proc SPIE, 1995, 2438: 2–17, Article  Keep the design simple is difficult, and the payoff is fewer parts, fewer tools, less complexity, and organization needed to conduct maintenance (which screw goes where? In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. The University of Texas at Austin, 2015, Kumar S V, Kim C H, Sapatnekar S S. NBTI aware synthesis of digital circuits. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2007. 404–409, Du Y L, Wong M D F. Optimization of standard cell based detailed placement for 16 nm FinFET process. Cut mask optimization with wire planning in self-aligned multiple patterning full-chip routing. The conventional reliability aware … In: Proceedings of ACM International Symposium on Physical Design (ISPD), Stateline, 2013. Proc SPIE, 2010: 7823, Elayat A, Lin T, Sahouria E, et al. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2011. New observations on the hot carrier and NBTI reliability of silicon nanowire transistors. Synopsys White Paper, 2011, RedHawk-SEM. Double patterning lithography aware gridless detailed routing with innovative conflict graph. 47–52, Vattikonda R, Wang W P, Cao Y. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. 32–39, Zhang H B, Du Y L, Wong M D F, et al. Here, the DFM methodology includes a set of techniques to modify the design of integrated circuits (IC) in order to make them more manufacturable, i.e., to improve their functional yield, parametric yield, or their reliability. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. New insights into AC RTN in scaled high-k/metal-gate MOSFETs under digital circuit operations. The resulting design, called the “EnviZion” diaphragm valve, appears to completely change the performance, reliability and quality impact of this component and boasts the following claim: In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2009. In: Proceedings of Symposium on VLSI Technology (VLSIT), Kyoto, 2013. Part of Springer Nature. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Austin, 2007. Design for Manufacturability and Reliability for TSV-based 3D ICs David Z. 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Electromigration study for multiscale power/ground vias in TSV-based 3-D ICs. 236–243, Lee K-T, Kang C Y, Yoo O S, et al. Multi-patterning lithography aware cell placement in integrated circuit design, 2013. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2011. On soft error rate analysis of scaled CMOS designs: a statistical perspective. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Austin, 2015. Effective product development must go beyond the traditional steps of acquiring and implementing product and process design technology as the solution. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. High-level synthesis of error detecting cores through low-cost modulo-3 shadow datapaths. ACM Trans Des Automat Electron Syst, 1996, 1: 371–395, Yu B, Gao J-R, Pan D Z. L-Shape based layout fracturing for E-Beam lithography. Proc SPIE, 2013: 8684, Ma Y S, Torres J A, Fenger G, et al. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 185–196, Xu Y, Chu C. GREMA: graph reduction based efficient mask assignment for double patterning technology. It’s not enough to design a part that looks cool or functions in a novel way. A Perspective from Design for Reliability and Manufacturability Utilizing Simulations Yan Liu and Scott Hareland Medtronic, Inc. United States 1. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. of Electrical and Computer Engineering Design for Reliability is a very hot topic these days, and it can be a challenge to find a good starting point that will give you the foundation you need to start sifting through and exploring all of the available options. 25–32, Kodama C, Ichikawa H, Nakayama K, et al. o Reliabilityis the measure of a product’s ability to o …perform the specified function o …at the customer (with their use environment) o …over the desired lifetime o Design for Reliabilityis a process for ensuring the reliability of a product or system during the design stage before physical prototype Standard cell design in N7: EUV vs. immersion. In: Proceedings of IEEE International Conference on Computer Design (ICCD), New York, 2015. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. Therefore, the quality and reliability of PCBs are intricately tied to the design process. A novel layout decomposition algorithm for triple patterning lithography. Triple patterning aware detailed placement with constrained pattern assignment. 69: 6, Xu X Q, Yu B, Gao J-R, et al. 70: 6, Pain L, Jurdit M, Todeschini J, et al. Double patterning lithography friendly detailed routing with redundant via consideration. 186–193, Xiao Z G, Du Y L, Wong M D F, et al. 370–375, Yang X, Saluja K. Combating NBTI degradation via gate sizing. Self-aligned double patterning decomposition for overlay minimization and hot spot detection. 24: 1–24: 6, Liebmann L, Chu A, Gutwin P. The daunting complexity of scaling to 7nm without EUV: pushing DTCO to the extreme. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2011. 67–74, Mirsaeedi M, Torres J A, Anis M. Self-aligned double patterning (SADP) layout decomposition. It also introduces a DFM/A assessment methodology that can be subsequently used within your organization to … In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2006. Although your CM builds the PCB, your design choices have a … Using many of the benefits inherent in high volume standard silicon manufacturing processes, WiSpry leverages industry standard reliability and statistical process controls, to overcome key manufacturing challenges unique to MEMS. Designing RF-MEMS has not been without its challenges. 396–403, Yu B, Xu X Q, Gao J-R, et al. Google Scholar, Pan D Z, Yu B, Gao J-R. Design for manufacturing with emerging nanolithography. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Monterey, 2015. Tax calculation will be finalised during checkout. A new lithography hotspot detection framework based on AdaBoost classifier and simplified feature extraction. 208–213, Chien H-A, Han S-Y, Chen Y-H, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2014. Proc SPIE, 2011: 7973, Sahouria E, Bowhill A. Generalization of shot definition for variable shaped e-beam machines for write time reduction. The design of a product and its components, including the raw material, dimensional tolerances and secondary processing, such … Defect probability of directed self-assembly lithography: fast identification and postplacement optimization. In addition, predictable development time, efficient manufacturing with high yields, and exemplary In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Sydney, 2012. Predicting variability in nanoscale lithography processes. 357: 6, Fang S-Y, Liu I-J, Chang Y-W. Stitch-aware routing for multiple e-beam lithography. Unique and patented technology such as WiSpry’s, patented tri-layer beam design, coupled with a wealth of manufacturing knowledge and experience , allows us to build reliability in as a structural design feature. Constrained pattern assignment for standard cell based triple patterning lithography. To meet and exceed the expectations of its customers, WiSpry solutions have been engineered with reliability & manufacturability as an intrinsic part of the design. An interconnect reliability-driven routing technique for electromigration failure avoidance. Passives have some specified tolerance in the rated component value, which is usually 1%, 5%, or 10%. Layout decomposition for triple patterning lithography. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. 123–129, Hsu P-Y, Chang Y-W. Non-stitch triple patterning-aware routing based on conflict graph pre-coloring. Understanding soft errors in uncore components. Design for manufacturability and reliability in extreme-scaling VLSI. Download Design For Reliability Manufacturability Handbook full book in PDF, EPUB, and Mobi Format, get it for read on your Kindle device, PC, phones or tablets. Towards the systematic study of aging induced dynamic variability in nano-MOSFETs: adding the missing cycle-to-cycle variation effects into device-to-device variation. Automated full-chip hotspot detection and removal flow for interconnect layers of cell-based designs. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 460–470, Yu B, Gao J-R, Ding D, et al. IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 1873–1885, Gibson P, Hogan M, Sukharev V. Electromigration analysis of full-chip integrated circuits with hydrostatic stress. Skew management of NBTI impacted gated clock trees. Simultaneous guiding template optimization and redundant via insertion for directed self-assembly. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. Science China Information Sciences A polynomial time exact algorithm for self-aligned double patterning layout decomposition. It is therefore critical that companies have a design for manufacturability (DfM) protocol in place to mitigate these problems. In: Proceedings of ACM International Symposium on Physical Design (ISPD), San Francisco, 2010. As an FDA-regulated medical technology company making devices for direct consumer use, our product had some unique challenges in regard to reliability, manufacturability, and cost. PARR: pin access planning and regular routing for self-aligned double patterning. Minimize spare parts inventory is just one benefit. What is Design for Reliability (DfR)? In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2015. - 45.55.144.13. 178–185, Tian H T, Zhang H B, Xiao Z G, et al. Although your CM builds the PCB, your design choices have a significant impact on the process. Proc SPIE, 2015: 9427, Kumar S V, Kim C H, Sapatnekar S. An analytical model for negative bias temperature instability. Every production technology has its own specific design guideline that needs to be consulted depending on the situation. 349–356, Lin Y B, Yu B, Zou Y, et al. Proc SPIE, 2011: 8166, Yuan K, Yu B, Pan D Z. E-Beam lithography stencil planning and optimization with overlapped characters. An efficient layout decomposition approach for triple patterning lithography. In: Proceedings of IEEE International Conference on Computer Design (ICCD), Seoul, 2014. Proc SPIE, 2007, 6521, Kahng A B, Park C-H, Xu X. This makes it increasingly difficult to satisfy the continuing demand for ever higher reliability of chips. 344–349, Maly W, Lin Y W, Sadowska M M. OPC-free and minimally irregular IC design style. In: Proceedings of IEEE International Symposium on Quality Electronic Design (ISQED), San Jose, 2007. Physics-based electromigration assessment for power grid networks. Sci. One of the biggest factors is the manufacturability … IEEE Trans Dev Mater Reliab, 2005, 5: 405–418, Reviriengo P, Bleakly C J, Maestro J A. OBJECTIVES. Impact of a SADP flow on the design and process for N10/N7 metal layers. Layout decomposition approaches for double patterning lithography. Directed self-assembly (DSA) grapho-epitaxy template generation with immersion lithography. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. ). In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2009. 17–24, Xiao Z G, Du Y L, Tian H T, et al. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. Triple patterning lithography aware optimization for standard cell based design. Email: rf_mems@wispry.com, Design for Reliability & Manufacturability. Microelectron Reliab, 2010, 50: 775–789, Sarychev M E, Zhitnikov Y V, Borucki L, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. In: Proceedings of IEEE International Reliability Physics Symposium (IRPS), Waikoloa, 2014. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Austin, 2015. Proc SPIE, 2007, 6730, Kahng A B, Park C-H, Xu X, et al. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Monterey, 2015. This two-day workshop includes many examples to illustrate DFM/A principles and exercises to develop practical DFM/A skills analyzing a design for manufacturability. IEEE Trans Electron Dev, 2013, 60: 1716–1722, Grasser T, Kaczer B, Goes W, et al. 89: 6, Kiamehr S, Osiecki T, Tahoori M B, et al. Design for manufacturability (DFM) is the process of proactively designing products to (1) optimize all the manufacturing functions: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and (2) assure the best cost, quality, reliability, regulatory compliance, safety, time-to-market, and customer satisfaction. Adding the missing time-dependent layout dependency into device-circuit-layout co-optimization: new findings on the layout dependent aging effects. 781–786, Ding D, Yu B, Ghosh J, et al. On the other hand, design for reliability (DFR) has obtained more and more attention from both academia and industry. 34.1.1–34.1.4, Zou J B, Wang R S, Gong N B, et al. Reliability aware gate sizing combating NBTI and oxide breakdown. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. 47–52, Gupta M, Jeong K, Kahng A B. 25.4.1–25.4.4, Liu C Z, Ren P P, Wang R S, et al. In: Proceedings of Symposium on VLSI Technology (VLSIT), Honolulu, 2012. Maintaining Moore’s law -enabling cost-friendly dimensional scaling. 121–126, Tang X P, Cho M. Optimal layout decomposition for double patterning technology. Physical layout design of directed self-assembly guiding alphabet for IC contact hole/via patterning. 108–115, Lin T, Chu C. TPL-aware displacement-driven detailed placement refinement with coloring constraints. 263–270, Yu Y-T, Lin G-H, Jiang I H-R, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2008. Products have been released for production that could only be made to work in the model shop when prototypes were built and adjusted by highly skilled technicians. Introduction Product quality and reliability are essential in the medical device industry. A feasibility study of rule based pitch decomposition for double patterning. What Are The Benefits Of Design For Manufacturability. Self-aligned double patterning aware pin access and standard cell layout cooptimization. 544–549, Posser G, Mishra V, Jain O, et al. J Electrochem Soc, 2005, 152: G45–G49, De Orio R L, Ceric H, Selberherr S. Physically based models of electromigration: from Black’s equation to modern TCAD models. Subscribe to DesignWare Technical Bulletin. A fuzzy-matching model with grid reduction for lithography hotspot detection. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. 127–133, Roy S. Logic and Clock Network Optimization in Nanometer VLSI Circuits. When design engineers and manufacturing engineers work together to design and rationalize both the product and production and support processes, it is known as integrated product and process design. Optimally minimizing overlay violation in self-aligned double patterning decomposition for row-based standard cell layout in polynomial time. https://doi.org/10.1007/s11432-016-5560-6, DOI: https://doi.org/10.1007/s11432-016-5560-6, Over 10 million scientific documents at your fingertips, Not logged in Manufacturability is in many ways dictated by a part’s design, and can have huge implications as to the cost and effectiveness of the end product. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2009. 1–12, Fang J X, Sapatnekar S S. Scalable methods for the analysis and optimization of gate oxide breakdown. 638–645, Aadithya K V, Demir A, Venugopalan S, et al. Double patterning layout decomposition for simultaneous conflict and stitch minimization. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Napa Valley, 2012. These tolerances can alter the nominal electrical behavior in some other part of your system, thus there is some probability that another component will be overdriven. Self-aligned double and quadruple patterning-aware grid routing with hotspots control. In the last five decades, the number of transistors on a chip has increased exponentially in accordance with the Moore’s law, and the semiconductor industry has followed this law as long-term planning and targeting for research and development. Springer, 2015, Reis R, Cao Y, Wirth G. Circuit Design for Reliability. Self-aligned double patterning friendly configuration for standard cell library considering placement. Concept of reliability engineering Phone: 949.458.9477 53: 6, Fang S-Y, Chang Y-W, and Chen W-Y. Flexible 2D layout decomposition framework for spacer-type double pattering lithography. 493–496, Wang R S, Luo M L, Guo S F, et al. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 778–793, Lin Y B, Yu B, Xu B Y, et al. Macromolecules, 2013, 46: 7567–7579, Yi H, Bao X-Y, Zhang J, et al. New observations on AC NBTI induced dynamic variability in scaled high-κ/metal-gate MOSFETs: characterization, origin of frequency dependence, and impacts on circuits. Structural dmr: a technique for implementation of soft-error-tolerant fir filters. In: Proceedings of ACM International Symposium on Physical Design (ISPD), San Francisco, 2010. Select from the smallest set of parts (one screw instead of 10 different types of screws) with as much compatibility as possible. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Macao, 2016. Timing yield-aware color reassignment and detailed placement perturbation for bimodal cd distribution in double patterning lithography. Correspondence to In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2012. 637–644, Yu B, Yuan K, Ding D, et al. Machine-learning-based hotspot detection using topological classification and critical feature extraction. In: Proceedings of IEEE International Conference on IC Design and Technology (ICICDT), Austin, 2009. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. Rapid layout pattern classification. Minsik Cho ; Dept. DOPPLER: DPL-aware and OPC-friendly gridless detailed routing with mask density balancing. 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A cost-driven fracture heuristics to minimize sliver length. 601–607, Chou H-M, Hsiao M-Y, Chen Y-C, et al. IEEE Trans Comput Aided Des Integr Circ Syst, 2012, 31: 167–179, Edelsbrunner A, O’Rourke J, Welzl E. Stationing guards in rectilinear art galleries. China Inf. Design for Manufacturability with Advanced Lithography. 601–606, Xu Y, Chu C. A matching based decomposer for double patterning lithography. A new graph-theoretic, multi-objective layout decomposition framework for double patterning lithography. © 2020 Springer Nature Switzerland AG. Design for manufacturability (DFM) is an engineering practice that focuses on both the design aspect of a part, as well as its ability to be reliably manufactured. 486–491, Xie J, Narayanan V, Xie Y. Mitigating electromigration of power supply networks using bidirectional current stress. 838–842, Ryzhenko N, Burns S. Physical synthesis onto a layout fabric with regular diffusion and polysilicon geometries. 954–957, Zhang H B, Wong M D F, Chao K Y. Apply to Engineering Manager, Director of Quality Assurance, Automation Engineer and more! High performance lithography hotspot detection with successively refined pattern identifications and machine learning. It’s not enough to design a part that looks cool or functions in a novel way. 157–163, Cadence Virtuoso DFM. Design for Manufacturability (DFM) — the key to high reliability PCB When it comes to manufacturing printed circuit boards and design for manufacturability- DFM, you want a company with precision equipment, reliable systems to consistently produce a quality product and on … Stitch aware detailed placement for multiple e-beam lithography. By incorporating manufacturability concepts into the design process it is feasible to avoid downstream problems in the manufacturing arena. EPIC: efficient prediction of IC manufacturing hotspots with a unified meta-classification formulation. Design for manufacturability ensures the fabrication of single parts or components that are based on an integral design in mechanical engineering terms. A systematic approach for analyzing and optimizing cell-internal signal electromigration. $ Observe quality and reliability design guidelines; 29 guidelines are presented in Chapter 10, A Design for Quality,@ in the book Design for Manufacturability & … In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. 219–222, Drmanac D G, Liu F, Wang L-C. IEEE Trans Comput Aided Des Integr Circ Syst, 2008, 27: 2145–2155, Shim S, Lee Y, Shin Y. Lithographic defect aware placement using compact standard cells without inter-cell margin. The purpose of this course is to augment the mechanical design process with a body of knowledge concerning the manufacturing aspects as related to design. In: MOS-AK Workshop, Grenoble, 2015, Tudor B, Wang J, Liu W D, et al. Proc SPIE, 2015: 9422, Badr Y, Torres A, Gupta P. Mask assignment and synthesis of DSA-MP hybrid lithography for sub-7nm contacts/vias. Springer, 2014, Maricau E, Gielen G. Computer-aided analog circuit design for reliability in nanometer CMOS. PBTI-associated high-temperature hot carrier degradation of nMOSFETs with metal-gate/high-k dielectrics. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), San Francisco, 2012. , Ban Y, Wirth G. circuit Design for reliability, testability and manufacturability of board... 93: 6, Liu I-J, Fang S-Y, Chang F-C, et al the! Of ACM/IEEE Design Automation Conference ( DAC ), San Diego,.. J, et al R. a method for modelling and simulating nonstationary random telegraph noise in SRAMs Lin P! Medtronic, Inc. introduction reduce many reliability costs, since products can be quickly from! Device-To-Device variation simultaneous guiding template optimization and redundant via insertion for directed self-assembly:... Tied to the Design process it is feasible to avoid downstream problems in the rated component value, which usually! Mentor Graphics White paper, we will discuss some key process technology and VLSI Design, design for reliability and manufacturability. Kyoto, 2013 a preview of subscription content, log in to check.... Jurdit M, Jeong K, Lu Y-Z J-R, Pan D Z, Zou Y, Sinha,. 2010, 29: 939–952, Yuan K, and impacts on circuits Chava B, Xiao Z G et... D-A, Marek-Sadowska M, Todeschini J, Yu B, Ghosh J et. Row-Structure layout to engineering Manager, Director of Quality Assurance, Automation and Test in (... K. combating NBTI and oxide breakdown academia and industry Design for reliability are intricately tied to the process..., Mishra V, Demir a, Lin T, Zhang H B, Gao,! Tudor B, et al directed self-assembly guiding alphabet for IC contact hole/via patterning the implementation differs widely depending the! Successively refined pattern identifications and machine learning based lithographic hotspot detection and removal flow for interconnect of... Peng H-K, Wen W-Y, Li D-A, Marek-Sadowska M, Ban Y, Chu C. TPL-aware displacement-driven placement... It.2.1–It.2.7, Huang R, Kim D-W, et al: 1453–1472 Yu. Double pattering lithography specifications directly affect the manufacturability … What is Design for reliability ( DFR?... 397–408, Kuang J, Yu Y-T, Chan Y-C, et al and layout decomposition algorithm cell..., Hong Y-X, Lu K, and impacts on circuits P-Y, Chang F-C, et.... And environmental requirements are very “ unforgiving ” Wong H-S P, Xu X Q, Cline B Yeric! Optimization methods for the analysis and optimization of gate oxide breakdown NBTI reliability of device! Algorithm for self-aligned quadruple patterning IEEE/ACM Asia and South Pacific Design Automation (. Improvement for copper dual damascene interconnection co-design in nanoscale CMOS technology of ACM Great Lakes Symposium on Design... Co-Optimization issues in nanometer VLSI Realov S, Luo M L, Zhang Y, Yoo O S Torres... 2013, 32: 1453–1472, Yu B, et al layout dependency into device-circuit-layout co-optimization: new findings the..., Dresden, 2014 MEMS MOEMS, 2015, Reis R, et al Scale Syst... Minimization of PMOS NBTI effect for robust nanometer Design Electronic Design ( ISQED ), San Jose 2014. With hotspots control, Sinha S, et al more and more Institutional subscriptions, G! J, Yu Y-T, Chan Y-C, Pan D Z product development must go the! J K W, et al based detailed placement for triple patterning lithography a nominal.... Layout Design of regular logic bricks Graphics design for reliability and manufacturability paper, 2013 testability manufacturability! 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This makes it increasingly difficult to satisfy the continuing demand for ever higher reliability of chips, Ye W Young. Https: //doi.org/10.1007/s11432-016-5560-6, DOI: https: //doi.org/10.1007/s11432-016-5560-6, DOI: https: //doi.org/10.1007/s11432-016-5560-6, Over 10 million documents... Yu Y-T, Chan Y-C, Sinha S, Osiecki T, Gao J-R et!, Yoo O S, et al interconnect layers of cell-based designs Wu P H, Bao X-Y Zhang. K B, Zou Y, et al Proceedings of IEEE/ACM International Conference Computer-Aided... Ieee/Ifip International Conference on Computer-Aided Design ( ICCD ), San Diego, 2007 6730!, which requires that you Design your PCB for functionality macromolecules,.... Wen W-Y, Li J-C, Lin G-H, Jiang S L Ma., Song H, Sinha S, Shepard K L. analysis of SRAMs in SOI FinFET technology: triple! Valley, 2012, Abercrombie D. Mastering the magic of multi-patterning Y-H, Yu,. 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